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Engineer - Packaging Development - RFFE, Deutschlandsberg, Austria

Qualcomm Inc.


Location:
Deutschlandsberg
Date:
04/20/2018
2018-04-202018-05-19
Job Code:
1955955
Qualcomm Inc.
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Job Details

Job Title Engineer - Packaging Development - RFFE, Deutschlandsberg, Austria
Jobid 1955955
Location: Deutschlandsberg, AUT
Job Description:
**Job Id**
E1955955
Job Title
Engineer - Packaging Development - RFFE, Deutschlandsberg, Austria
Post Date
04/06/2018
Company
-
Division
Qualcomm Technologies, Inc.
-
CDMA Technology at http://www.qualcomm.com/about/businesses/qct
Job Area
Engineering - Hardware
Location
Austria - Deutschlandsberg
Job Overview
+ Work on Process R&D, with an emphasis on development and characterization of processes for Wafer Level Packaging of Surface Acoustic Waves (SAW) filters

+ Design and evaluation of experiments for the definitions of process window and process compatibility

+ Actively participate in process and technology development and pre-development activities

+ Design and implement process solutions that meet production and reliability requirements

+ Responsible for the evaluation and specification of R&D and production machines

+ Support process and technology transfer to manufacturing
Minimum Qualifications
+ Fluent in English written and verbal

+ Able to relocate to Deutschlandsberg, Austria

+ The ideal candidate will have experience in Wet Chemistry and Electroplating or Lithography

+ Should have a basic knowledge of metrology equipment, materials analysis techniques, and surface physics

+ Knowledge of statistics (DoE and SPC), data analysis and visualization

+ Have the ability to communicate well with different levels of the organization and build strong, working relationships outside the organization with external partners.

+ Candidate must be able to integrate into a technical team and assuming the right measures of ownership and accountability in a team environment.
Preferred Qualifications
as above
Education Requirements
+ BS degree in engineering, physics, chemistry or in a related discipline with demonstrated ability to perform technical research

+ Ph.D. degree in Engineering, Chemistry, Physics or other relevant engineering physical science discipline preferredPLEASE SUBMIT CVS AND SUPPORTING DOCUMENTATION IN ENGLISHWE INVENT THE TECH THE WORLD LOVES, SO IF YOU ARE INTERESTED IN LEARNING MORE https://www.qualcomm.com/weinvent
EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.


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