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Package/System/Module Design Lead

Qualcomm Inc.


Location:
San Diego, CA
Date:
01/19/2018
2018-01-192018-02-17
Job Code:
E1961368
Qualcomm Inc.
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Job Details

Title: Package/System/Module Design Lead
JobID: E1961368

Description:
Qualcomms Package Architecture and Design team has an opening for an IC Package Design Lead. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for Qualcomm package products (Digital, RF, Analog, PMIC, etc...) Job responsibilities for this position include package selection & package design. This involves optimizing system co-design of IC-PKG-PCB keeping in mind package footprint/height constraints, IC floor-planning, PCB co design
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