Senior Packaging Engineer (Silicon Photonics)

  • Location:
    San Jose, California, US
  • Additional Location(s)
    Taipei, Taiwan
  • Area of Interest
    Engineer - Hardware
  • Job Type
  • Technology Interest
  • Job Id

<b>Who You’ll Work With</b>

As part of the Optics Technology and Quality group, you'll be responsible for development and qualification of Cisco's Silicon Photonics wafer and chip scale packaging processes. Cisco's Silicon Photonics based interconnect products enable several of Cisco's Data Center, Enterprise and Service Provider solutions.

<b>What You’ll Do</b>
You'll drive optoelectronic packaging process development, package level test, reliability data collection and process qualification at Cisco's assembly supply chain. You'll be responsible for new process bring up from proof of concept through NPI stage, including troubleshooting critical issues and driving scale up activities. You will own reviewing process monitoring data, including yield and Cpks and correlate impact to downstream module level assembly quality, performance and reliability.

You'll also play a critical role in driving future optical and electrical I/O densities and advanced packaging architectures to enable next generation Silicon Photonics products.

<b>Who You Are</b>
Minimum requirements for this role include an MS or PhD in Materials Science, Mechanical Engineering, Electrical Engineering or related fields with 7+ years experience in CMOS or Photonics packaging and assembly process development and qualification.
Experience working with CMOS/Optical packaging suppliers, especially semiconductor OSATs is highly desirable.

The ideal candidate will also have experience with statistical data analysis, FMEAs and 5M problem solving. The candidate should have an established record of product development leadership resulting in yield improvements and successfully troubleshooting issues in a manufacturing environment.

Desired skills include a deep understanding of semiconductor or Photonics packaging processes, including current advanced wafer scale packaging technologies. Some experience with developing silicon photonics packaging technologies and taking them to high volume scale up would be a big plus. The candidate would be a great team player, with ability to collaborate with multiple geographically located internal and external teams toward achieving common goals.


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